Industry Directory: crack component (3)

Sonoscan, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

New SMT Equipment: crack component (64)

PCB Depanelers/depanelizing pcb/PCB depanelizer/PCB cutter/ 基板分割機.基板切断機

PCB Depanelers/depanelizing pcb/PCB depanelizer/PCB cutter/ 基板分割機.基板切断機

New Equipment | Depaneling

 The PCB Depanelers more detail and video please check the link: www.pcb-separator.com           Any inquiry please sent the email to : info@pcbasc.com   This machine can use for all kinds of PCB board. 1. Cutting with the double straight knives,

ASCEN Technology

ASM/Siemens Siplace Ceramic Nozzles

ASM/Siemens Siplace Ceramic Nozzles

New Equipment | Pick & Place

These new ceramic versions are available in the 901, 902, 904, 906, & 925 versions. Special vacuum geometry provides excellent performance in the machine which saves you time and money during production. The machined bodies are flexible, so that they

Count On Tools, Inc.

Electronics Forum: crack component (333)

NTC crack on body of component

Electronics Forum | Wed Sep 12 03:43:48 EDT 2018 | vlad_saviuk

Hello, have some problem and interesting, does any body faced with same issue. On most of our products we have NTC thermistor(like on the photo), and during assembly process and handling great amount of components cracked on PCBA so we need to replac

solder crack

Electronics Forum | Mon Jul 01 15:37:56 EDT 2002 | pjc

Possible cause can be design related- if the solder land is too small. Check w/ IPC SM-782 Solder Land Design Guide Another is board finish. I have seen problems like this with Gold finished PWBs- which creates a more brittle solder joint.Another pos

Used SMT Equipment: crack component (16)

Mirtec MV-6e omni

Mirtec MV-6e omni

Used SMT Equipment | AOI / Automated Optical Inspection

Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer

INSPECTION TECH

ASM Siemens SIPLACE TX4i

ASM Siemens SIPLACE TX4i

Used SMT Equipment | Pick and Place/Feeders

Make:  ASMModel: ASM SIPLACE TX4i Details:1.High Speed: The SIPLACE TX modules can achieve a placement speed of up to 78,000 cph, ensuring high-efficiency production. 2.High Accuracy: With a precision of up to 22 pm, the machine ensures high-quality

Extension Electromechanical equipment HK Co.,Ltd

Industry News: crack component (93)

Electronics Reliability And Sustainability Focus of IPC Technical Conference

Industry News | 2010-08-04 21:04:22.0

Manufacturing reliable and sustainable electronics that meet customer needs without failure during the product’s life cycle has been stymied by myriad challenges, from environmental regulations to new materials and processes. Bringing together the latest research by industry experts, IPC — Association Connecting Electronics Industries® will host a Technical Conference on Electronics Sustainability, September 28–30 at Electronics Midwest, in Rosemont, Ill. Electronics Midwest is produced jointly by IPC and Canon Communications.

Association Connecting Electronics Industries (IPC)

Typical RoHS Issues in PCB Assembly

Industry News | 2018-10-18 10:23:07.0

Typical RoHS Issues in PCB Assembly

Flason Electronic Co.,limited

Technical Library: crack component (9)

How to deal with the carrier tape and the cover tape sealing crack

Technical Library | 2019-08-14 08:27:46.0

There are five forms of carrier tape sealing cracking. In particular, it is more important to seal products such as IC components (IC tape carriers) and lighter and thinner LED components (LED tape carriers).

Shenzhen Sewate Technology Co.,Ltd

Avoidance of Ceramic-Substrate-Based LED Chip Cracking Induced by PCB Bending or Flexing

Technical Library | 2022-09-25 20:18:33.0

Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.

Cree Lighting

Videos: crack component (110)

V-cut cutting machine For internal strength generates during separation, Minimize it to value under 180uE ,to avoid PCB solder crack or component damage

V-cut cutting machine For internal strength generates during separation, Minimize it to value under 180uE ,to avoid PCB solder crack or component damage

Videos

http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch

ASCEN Technology

PCB cutting machine,PCB separator,PCB depaneling machine,V-cut depaneling machine,auto PCB cutting machine,Motorized PCB separator

PCB cutting machine,PCB separator,PCB depaneling machine,V-cut depaneling machine,auto PCB cutting machine,Motorized PCB separator

Videos

http://www.pcb-separator.com/html/PRODUCTS/PCB%20separator/2015/0607/132.html PCB cutting machine/guillotine separator/PCB depaneling machine/PCB panel separator ASCEN specializing the SMT assmebly line equipment manufacture the more detail please ch

ASCEN Technology

Training Courses: crack component (3)

IPC-A-600 Specialist (CIS) Certification Training Course

Training Courses | | | IPC-600 Specialist (CIS)

The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.

ACI Technologies, Inc.

Events Calendar: crack component (1)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Career Center - Resumes: crack component (1)

Michael Cooper (BSEE)

Career Center | Fayetteville, Arkansas USA | Engineering,Production

I enjoyed working in Electronics Manufacturing while in college (BSEE) and would like to pursue an engineering job in a related field.

Express Newsletter: crack component (736)

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com

SMT Express, Volume 3, Issue No. 5 - from SMTnet.com Volume 3, Issue No. 5 Thursday, May 17, 2001 Featured Article Return to Front Page A Closer Look at Area Array Components by Gil Zweig , Glenbrook Technologies, Inc . Combining

SMTnet Express - June 19, 2014

SMTnet Express, June 19, 2014, Subscribers: 22851, Members: Companies: 13906, Users: 36363 Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints Y

Partner Websites: crack component (205)


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